12 Layer ENIG FR4+Rogers Mixed Lamination High Frequency PCB
Mixed Lamination High Frequency PCB Board
There are three main reasons for using mixed lamination high frequency PCBs: cost, improved reliability and enhanced electrical performance.
1. Hf line materials are much more expensive than FR4. Sometimes, using mixed lamination of FR4 and hf lines can solve the cost problem.
2. In many cases, some lines of mixed lamination high frequency PCB board require high electrical performance, and some do not.
3. FR4 is used for the less electrically demanding part, while the more expensive high-frequency material is used for the more electrically demanding part.
FR4+Rogers Mixed Lamination High Frequency PCB Board
Mixed lamination of FR4 and hf materials is becoming increasingly common, as FR4 and most HF line materials have few compatibility problems. However, there are several problems with PCB manufacturing that deserve attention.
Using high frequency materials in the mixed lamination structure can cause because of special process and guide of the great difference of temperature. High frequency materials based on PTFE present many problems during the manufacturing of circuits due to the special drilling and preparation requirements for PTH. Hydrocarbon-based panels are easy to manufacture using the same wiring process technology as standard FR4.
Mixed Lamination High Frequency PCB Materials
Rogers |
Taconic |
Wang-ling |
Shengyi |
Mixed lamination |
Pure lamination |
| RO3003 | TLY-5 | F4BM220 | S7136 | RO4350B+FR4 | RO4350B+RO4450F+RO4350B |
| RO3010 | TLX-6 | F4BM225 | RO4003C+FR4 | RO4003C+RO4450F+RO4003C | |
| RO4003C | TLX-8 | F4BM265 | RF-35+FR4 | F4BME+RO4450F+F4BME | |
| RO4350B | RF-35 | F4BM300 | TLX-8+FR4 | ||
| RO5880 | F4BM350 | F4BME+FR4 |
