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    • 10 Layer ENIG FR4 Via In Pad PCB

      10 Layer ENIG FR4 Via In Pad PCB

      Layer: 10
      Surface finish: ENIG
      Material: FR4 Tg170
      Outer line W/S: 10/7.5mil
      Inner line W/S: 3.5/7mil
      Board thickness: 2.0mm
      Min. hole diameter: 0.15mm
      Plug hole: via filling plating

    • 8 Layer ENIG FR4 Via-In-Pad PCB

      8 Layer ENIG FR4 Via-In-Pad PCB

      Layers: 8
      Surface finish: ENIG
      Base material: FR4
      Outer Layer W/S: 4/3.5mil
      Inner layer W/S: 4/3.5mil
      Thickness: 1.0mm
      Min. hole diameter:0.2mm
      Special process: via-in-pad, impedance control

    • 10 Layer Impedance Control Resin Plugging PCB

      10 Layer Impedance Control Resin Plugging PCB

      Layers: 10
      Surface finish: ENIG
      Aspect Ratio: 8:1
      Base material: FR4
      Outer Layer W/S: 4/4mil
      Inner layer W/S: 5/3.5mil
      Thickness: 2.0mm
      Min. hole diameter:0.25mm
      Special process: Impedance Control, Resin Plugging, Different Copper Thickness

    • 8 Layer ENIG FR4 Via-In-Pad PCB

      8 Layer ENIG FR4 Via-In-Pad PCB

      Layers: 8
      Surface finish: ENIG
      Base material: FR4
      Outer Layer W/S: 4.5/3.5mil
      Inner layer W/S: 4.5/3.5mil
      Thickness: 1.2mm
      Min. hole diameter:0.15mm
      Special process: via-in-pad

    • 6 Layer ENIG FR4 Via-In-Pad PCB

      6 Layer ENIG FR4 Via-In-Pad PCB

      Layers: 6
      Surface finish: ENIG
      Base material: FR4
      Outer Layer W/S: 4/3.5mil
      Inner layer W/S: 4/3.5mil
      Thickness: 2.0mm
      Min. hole diameter:0.25mm
      Special process: via-in-pad Impedance Control

    • 6 Layer ENIG FR4 Via-In-Pad PCB

      6 Layer ENIG FR4 Via-In-Pad PCB

      Layers: 6
      Surface finish: ENIG
      Base material: FR4
      W/S: 5/4mil
      Thickness: 1.0mm
      Min. hole diameter:0.2mm
      Special process: via-in-pad

    • 16 Layer ENIG Press Fit Hole PCB

      16 Layer ENIG Press Fit Hole PCB

      Layers: 16
      Surface finish: ENIG
      Base material: FR4
      Thickness: 3.0mm
      Min. hole diameter:0.35mm
      size:420×560mm
      Outer Layer W/S: 4/3mil
      Inner layer W/S: 5/4mil
      Aspect Ratio: 9:1
      Special process: via-in-pad Impedance Control Press Fit Hole

    • 6 Layer FR4 ENIG Via In Pad PCB

      6 Layer FR4 ENIG Via In Pad PCB

      Layers: 6
      Surface finish: ENIG
      Base material: FR4
      Outer Layer W/S: 4/3.5mil
      Inner layer W/S: 4.5/3.5mil
      Thickness: 1.0mm
      Min. hole diameter:0.2mm
      Special process: via in pad

    • 6 Layer ENIG Via-In-Pad PCB

      6 Layer ENIG Via-In-Pad PCB

      Product name: 6 Layer ENIG Via-In-Pad PCB
      Layers: 6
      Surface finish: ENIG
      Base material: FR4
      Outer Layer W/S: 7/3.5mil
      Inner layer W/S: 7/4mil
      Thickness: 0.8mm
      Min. hole diameter:0.2mm
      Special process: via-in-pad