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4 Layer ENIG FR4 Half Hole PCB
Layers: 4
Surface finish: ENIG
Base material: FR4
Outer Layer W/S: 9/4mil
Inner layer W/S: 7/4mil
Thickness: 0.8mm
Min. hole diameter: 0.2mm
Special process:Impedance, half hole
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6 Layer ENIG Impedance Half Hole PCB
Layers: 6
Surface finish: ENIG
Base material: FR4
Outer Layer W/S: 4/4mil
Inner layer W/S: 4/4mil
Thickness: 1.2mm
Min. hole diameter: 0.2mm
Special process:Impedance, half hole -
4 Layer HASL FR4 Half Hole PCB
Layers: 4
Surface finish: LF-HASL
Base material: FR4
Outer Layer W/S: 9/6mil
Inner layer W/S: 9/5mil
Thickness: 0.8mm
Min. hole diameter: 0.3mm
Special process:half hole -
4 Layer ENIG FR4 Half Hole PCB
Layers: 4
Surface finish: ENIG
Base material: FR4
Outer Layer W/S: 4/3mil
Inner layer W/S: 6/4mil
Thickness: 0.8mm
Min. hole diameter: 0.2mm
Special process:half hole -
4 Layer ENIG FR4 Half Hole PCB
Layers: 4
Surface finish: ENIG
Base material: FR4
Outer Layer W/S: 8/4mil
Inner layer W/S: 8/4mil
Thickness: 0.6mm
Min. hole diameter: 0.2mm
Special process:half hole -
4 Layer ENIG Impedance Half Hole PCB
Layers: 4
Surface finish: ENIG
Base material: FR4
Outer Layer W/S: 6/4mil
Inner layer W/S: 6/4mil
Thickness: 0.4mm
Min. hole diameter: 0.6mm
Special process:Impedance,half hole -
2 Layer HASL FR4 Half Hole PCB
Layers: 2
Surface finish: LF-HASL
Base material: FR4
Outer Layer W/S: 9/5mil
Thickness: 1.6mm
Min. hole diameter: 0.4mm
Special process: half hole -
8 Layer ENIG FR4 Half Hole PCB
Layers: 8
Surface finish: ENIG
Base material: FR4
Outer Layer W/S: 4/3mil
Inner layer W/S: 5/4mil
Thickness: 1.6mm
Min. hole diameter: 0.2mm -
4 Layer ENIG FR4 Half Hole PCB
Layers: 4
Surface finish: ENIG
Base material: FR4
Outer Layer W/S: 4/4mil
Inner layer W/S: 4/4mil
Thickness: 0.8mm
Min. hole diameter: 0.15mm
