-
6 Layer ENIG RO4350+FR4 Mixed Lamination PCB
Layers: 6
Surface finish: ENIG
Base material: ROGERS 4350 + FR4
Outer Layer W/S: 7/7mil
Inner layer W/S: 5/5mil
Thickness: 2.3mm
Min. hole diameter: 0.6mm
Special process:mixed-dielectric -
4 Layer ENIG FR4+RO4350 Mixed Lamination High Frequency PCB
Layers: 4
Materials:FR4+Rogers 4350B
Min. hole diameter: 0.3mm
Minimum Line Width：0.230mm
Minimum Line Space：0.170mm
Surface Treatment：ENIG
Thickness:1.0mm -
4 Layer ENIG Taconic RF-35 High Frequency PCB
Layers: 4
Surface finish: ENIG
Base material: Taconic RF-35
Min. hole diameter: 0.8mm
Outer Layer W/S: 12/12mil
Inner layer W/S: 12/12mil
Thickness: 0.762mm -
2 Layer OSP F4B High Frequency PCB
Layers: 2
Base material: F4BM
Copper thick：1 OZ
Surface finish: OSP
Thickness: 1.6mm -
4 Layer ENIG RO4350 High Frequency PCB
Layers: 4
size：104*100mm
Surface finish: ENIG
Base material: Rogers 4350B
Min. hole diameter: 0.3mm
Minimum Line Width：0.165mm
Minimum Line Space：0.124mm
Thickness: 0.8mm -
6 Layer ENIG FR4+RO4350 Mixed Lamination PCB
Layers: 6
size：357*224mm
Surface finish: ENIG
Base material: FR4 TG170, Rogers 4350B
Min. hole diameter: 0.25mm
Minimum Line Width：0.127mm
Minimum Line Space：0.127mm
Thickness: 1.6mm
Special process:Blind hole -
4 Layer ENIG FR4+R04350 Mixed Lamination PCB
Layers: 4
size：61.6*27mm
Surface finish: ENIG
Base material: FR4+Rogers 4350B
Min. hole diameter: 0.3mm
Minimum Line Width：0.252mm
Minimum Line Space：0.102mm
Thickness: 1.6mm -
4 Layer ENIG FR4+RO4350 Mixed Lamination PCB
Layers: 4
size：190*210mm
Surface finish: ENIG
Base material: FR4+Rogers 4350B
Min. hole diameter: 0.4mm
Minimum Line Width：0.279mm
Minimum Line Space：0.1mm
Thickness:1.4mm -
4 Layer ENIG RO4003+AD255 Mixed Lamination PCB
Layers: 4
Surface finish: ENIG
Base material: Arlon AD255+Rogers RO4003C
Min. hole diameter: 0.5mm
Minimum W/S：7/6mil
Thickness: 1.8mm
Special process:Blind hole
