Introduction To The Steps Of The Process:
1. Opening Material
Cut the raw material copper clad laminate to the required size for production and processing.
Main equipment: material opener.
2. Making The Graphics Of The Inner Layer
The photosensitive anti-corrosion film is covered on the surface of the copper clad laminate, and the anti-etching protection pattern is formed on the surface of the copper clad laminate by exposure machine, and then the conductor circuit pattern is formed by developing and etching on the surface of the copper clad laminate.
Main equipment: copper plate surface cleaning horizontal line, film pasting machine, exposure machine, horizontal etching line.
3. Inner Layer Pattern Detection
The automatic optical scanning of the conductor circuit pattern on the surface of copper clad laminate is compared with the original design data to check whether there are some defects such as open / short circuit, notch, residual copper and so on.
Main equipment: optical scanner.
4. Browning
An oxide film is formed on the surface of the conductor line pattern, and a microscopic honeycomb structure is formed on the smooth conductor pattern surface, which increases the surface roughness of the conductor pattern, thereby increasing the contact area between the conductor pattern and the resin, enhancing the bonding strength between the resin and the conductor pattern, and then enhancing the heating reliability of the multilayer PCB.
Main equipment: horizontal browning line.
5. Pressing
The copper foil, the semi-solidified sheet and the core board (copper clad laminate) of the made pattern are superimposed in a certain order, and then bonded into a whole under the condition of high temperature and high pressure to form a multilayer laminate.
Main equipment: vacuum press.
6.Drilling
NC drilling equipment is used to drill holes on the PCB board by mechanical cutting to provide channels for interconnected lines between different layers or positioning holes for subsequent processes.
Main equipment: CNC drilling rig.
7 .Sinking Copper
By means of autocatalytic redox reaction, a layer of copper was deposited on the surface of resin and glass fiber on the through-hole or blind-hole wall of PCB board, so that the pore wall had electrical conductivity.
Main equipment: horizontal or vertical copper wire.
8.PCB Plating
The whole board is electroplated by the method of electroplating, so that the thickness of copper in the hole and surface of the circuit board can meet the requirements of a certain thickness, and the electrical conductivity between different layers of the multilayer board can be realized.
Main equipment: pulse plating line, vertical continuous plating line.
9. Production Of Outer Layer Graphics
A photosensitive anti-corrosion film is covered on the surface of the PCB, and the anti-etching protection pattern is formed on the surface of the PCB by exposure machine, and then the conductor circuit pattern is formed on the surface of the copper clad laminate by development and etching.
Main equipment: PCB board cleaning line, exposure machine, development line, etching line.
10. Outer Layer Pattern Detection
The automatic optical scanning of the conductor circuit pattern on the surface of copper clad laminate is compared with the original design data to check whether there are some defects such as open / short circuit, notch, residual copper and so on.
Main equipment: optical scanner.
11. Resistance Welding
The liquid photoresist flux is used to form a solder resistance layer on the surface of the PCB board through the process of exposure and development, so as to prevent the PCB board from being short-circuited when welding components.
Main equipment: screen printing machine, exposure machine, development line.
12. Surface Treatment
A protective layer is formed on the surface of the conductor circuit pattern of the PCB board to prevent the oxidation of the copper conductor to improve the long-term reliability of PCB.
Main equipment: Shen Jin Line, Shen Tin Line, Shen Yin Line, etc.
13.PCB Legend Printed
Print a text mark on the specified position on the PCB board, which is used to identify various component codes, customer tags, UL tags, cycle marks, etc.
Main equipment: PCB legend printed machine
14. Milling Shape
The edge of the PCB board tool is milled by a mechanical milling machine to obtain the PCB unit that meets the design requirements of the customer.
Main equipment: milling machine.
15 .Electrical Measurement
Electrical measuring equipment is used to test the electrical connectivity of the PCB board to detect the PCB board that can not meet the customer's electrical design requirements.
Main equipment: electronic testing equipment.
16 .Appearance Examination
Check the surface defects of the PCB board to detect the PCB board that can not meet the customer's quality requirements.
Main equipment: FQC appearance inspection.
17. Packing
Pack and ship the PCB board according to customer requirements.
Main equipment: automatic packing machine
