Layers: 4 Surface finish: ENIG Base material: FR4 Tg170 Outer Layer W/S: 5.5/6mil Inner layer W/S: 17.5mil Thickness: 1.0mm Min. hole diameter: 0.5mm Special process: Blind Vias
Layers: 10 Surface finish: ENIG Base material: FR4 W/S: 4/4mil Thickness: 1.6mm Min. hole diameter: 0.2mm Special process: Blind Vias
Layers: 6 Surface finish: HASL Base material: FR4 Outer Layer W/S: 9/4mil Inner layer W/S: 11/7mil Thickness:1.6mm Min. hole diameter: 0.3mm
Layers: 8 Surface finish: ENIG Base material: FR4 Outer Layer W/S: 3/3mil Inner layer W/S: 3/3mil Thickness: 0.8mm Min. hole diameter: 0.1mm Special process: Blind & Buried Vias
Layers: 14 Surface finish: ENIG Base material: FR4 Outer Layer W/S: 4/5mil Inner layer W/S: 4/3.5mil Thickness: 1.6mm Min. hole diameter: 0.2mm Special process: Blind & Buried Vias
Layers: 4 Surface finish: ENIG Base material: FR4 Outer Layer W/S: 6/4mil Inner layer W/S: 6/5mil Thickness:1.6mm Min. hole diameter: 0.3mm Special process: Blind & Buried Vias, impedance control
Layers: 12 Surface finish: ENIG Base material: FR4 Outer Layer W/S: 7/4mil Inner layer W/S: 5/4mil Thickness:1.5mm Min. hole diameter: 0.25mm
Layers: 8 Surface finish: ENIG Base material: FR4 Outer Layer W/S: 4.5/3.5mil Inner layer W/S: 4.5/3.5mil Thickness: 1.6mm Min. hole diameter: 0.25mm Special process: Blind & Buried Vias ,impedance control
Layers: 6 Surface finish: ENIG Base material: FR4 W/S: 5/4mil Thickness: 1.0mm Min. hole diameter: 0.2mm Special process: Blind Vias
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