Layers: 6
Surface finish: ENIG
Base material: FR4
Outer Layer W/S: 4/4mil
Inner layer W/S: 4/4mil
Thickness: 1.2mm
Min. hole diameter:0.2mm
Special process: Impedance Control
Outer Layer W/S: 4.5/3.5mil
Inner layer W/S: 4.5/3.5mil
Thickness: 1.0mm
Layers: 4
Surface finish: OSP
Outer Layer W/S: 6/4mil
Thickness: 1.6mm
Min. hole diameter:0.25mm
Outer Layer W/S: 7/4mil
Inner layer W/S: 7/4mil
Thickness: 2.0mm
Thickness: 2.8mm
Min. hole diameter:0.35mm
Layers: 10
Aspect Ratio: 8:1
Inner layer W/S: 5/3.5mil
Special process: Impedance Control, Resin Plugging, Different Copper Thickness
Min. hole diameter: 0.25mm
Thickness diameter ratio:8:1
Layers: 12 Surface finish: ENIG Base material: FR4 Outer Layer W/S: 5/4mil Inner layer W/S: 4/5mil Thickness: 3.0mm Min. hole diameter: 0.3mm Special process: 5/5mil impedance control line
Layers: 8 Surface finish: ENIG Base material: FR4 Tg150 Outer Layer W/S: 5/4mil Inner layer W/S: 4/4mil Thickness: 1.6mm Min. hole diameter:0.2mm Special process: Impedance Control
Layers: 6 Surface finish: ENIG Base material: FR4 Outer Layer W/S: 4/4mil Inner layer W/S: 4/4mil Thickness: 1mm Min. hole diameter:0.25mm Special process: Impedance Control
+86 13058186932
em01@huihepcb.com
+86 13751177644