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10 Layer ENIG FR4 Impedance Control PCB
Layers: 10
Surface finish: ENIG
Base material: FR4
Outer Layer W/S: 4/4mil
Inner layer W/S: 5/3.5mil
Thickness: 2.0mm
Min. hole diameter: 0.25mm
Thickness diameter ratio：8:1
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6 Layer FR4 ENIG Impedance Control PCB
Layers: 6
Surface finish: ENIG
Base material: FR4
Outer Layer W/S: 6/4mil
Inner layer W/S: 4/4mil
Thickness: 2.8mm
Min. hole diameter:0.35mm
Special process: Impedance Control
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4 Layer FR4 ENIG Impedance Control PCB
Layers: 4
Surface finish: ENIG
Base material: FR4
Outer Layer W/S: 4/4mil
Thickness: 1.6mm
Min. hole diameter:0.2mm
Special process: Impedance Control
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8 Layer FR4 ENIG Impedance Control PCB
Layers: 8
Surface finish: ENIG
Base material: FR4 Tg150
Outer Layer W/S: 5/4mil
Inner layer W/S: 4/4mil
Thickness: 1.6mm
Min. hole diameter:0.2mm
Special process: Impedance Control -
6 Layer FR4 ENIG Impedance Control PCB
Layers: 6
Surface finish: ENIG
Base material: FR4
Outer Layer W/S: 7/4mil
Inner layer W/S: 7/4mil
Thickness: 2.0mm
Min. hole diameter:0.25mm
Special process: Impedance Control -
4 Layer FR4 OSP Impedance Control PCB
Layers: 4
Surface finish: OSP
Base material: FR4
Outer Layer W/S: 6/4mil
Inner layer W/S: 4/4mil
Thickness: 1.6mm
Min. hole diameter:0.25mm
Special process: Impedance Control -
6 Layer FR4 ENIG Impedance Control PCB
Layers: 6
Surface finish: ENIG
Base material: FR4
Outer Layer W/S: 4.5/3.5mil
Inner layer W/S: 4.5/3.5mil
Thickness: 1.0mm
Min. hole diameter:0.2mm
Special process: Impedance Control -
6 Layer FR4 ENIG Impedance Control PCB
Layers: 6
Surface finish: ENIG
Base material: FR4
Outer Layer W/S: 4/4mil
Inner layer W/S: 4/4mil
Thickness: 1.2mm
Min. hole diameter:0.2mm
Special process: Impedance Control -
6 Layer FR4 ENIG Impedance Control PCB
Layers: 6
Surface finish: ENIG
Base material: FR4
Outer Layer W/S: 4/4mil
Inner layer W/S: 4/4mil
Thickness: 1mm
Min. hole diameter:0.25mm
Special process: Impedance Control
