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Professional Design Printed Circuit Board Production - 14 Layer ENIG FR4 Buried Via PCB – Huihe

Professional Design Printed Circuit Board Production - 14 Layer ENIG FR4 Buried Via PCB – Huihe

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We rely upon strategic thinking, constant modernisation in all segments, technological advances and of course upon our employees that directly participate in our success for Custom Circuit Board Printing, Teflon Pcb Board, Pcb Components Assembly, Our products are widely recognized and trusted by users and can meet continuously changing economic and social needs.
Professional Design Printed Circuit Board Production - 14 Layer ENIG FR4 Buried Via PCB – Huihe Detail:

About Blind Buried Via PCB

Blind vias and buried vias are two ways to establish connections between layers of printed circuit board. The blind vias of the printed circuit board are copper-plated vias that can be connected to the outer layer through most of the inner layer. The burrow connects two or more inner layers but does not penetrate the outer layer. Use microblind vias to increase line distribution density, improve radio frequency and electromagnetic interference, heat conduction, applied to servers, mobile phones, digital cameras.

Buried Vias PCB

The buried Vias connects two or more inner layers but does not penetrate the outer layer

Min Hole Diameter/mm

Min ring/mm

via-in-pad Diameter/mm

Maximum Diameter/mm

Aspect Ratio

Blind Vias(conventional)

              0.1

      0.1

          0.3

           0.4

    1:10

Blind Vias(special product)

              0.075

      0.075

          0.225

           0.4

    1:12

Blind Vias PCB

Blind Vias is to connect an outer layer to at least one inner layer

 

Min. Hole Diameter/mm

Minimum ring/mm

via-in-pad Diameter/mm

Maximum Diameter/mm

Aspect Ratio

Blind Vias(mechanical drilling)

    0.1

     0.1

     0.3

     0.4

   1:10

Blind Vias(Laser drilling)

    0.075

     0.075

     0.225

     0.4

   1:12

The advantage of blind Vias and buried Vias for engineers is the increase of component density without increasing layer number and size of circuit board. For electronic products with narrow space and small design tolerance, blind hole design is a good choice. The use of such holes helps the circuit design engineer to design a reasonable hole/pad ratio to avoid excessive ratios.


Product detail pictures:

Professional Design Printed Circuit Board Production - 14 Layer ENIG FR4 Buried Via PCB – Huihe detail pictures

Professional Design Printed Circuit Board Production - 14 Layer ENIG FR4 Buried Via PCB – Huihe detail pictures

Professional Design Printed Circuit Board Production - 14 Layer ENIG FR4 Buried Via PCB – Huihe detail pictures


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Our concentrate on is always to consolidate and enhance the excellent and service of present solutions, in the meantime regularly develop new products to meet distinctive customers' demands for Professional Design Printed Circuit Board Production - 14 Layer ENIG FR4 Buried Via PCB – Huihe , The product will supply to all over the world, such as: Romania, Anguilla, Tunisia, With high quality, reasonable price, on-time delivery and customized & personalized services to help customers achieve their goals successfully, our company has got praise in both domestic and foreign markets. Buyers are welcome to contact us.
  • As an international trading company, we have numerous partners, but about your company, I just want to say, you are really good, wide range, good quality, reasonable prices, warm and thoughtful service, advanced technology and equipment and workers have professional training, feedback and product update is timely, in short, this is a very pleasant cooperation, and we look forward to the next cooperation!
    5 Stars By Kevin Ellyson from Lyon - 2018.12.11 11:26
    The company leader recept us warmly, through a meticulous and thorough discussion, we signed a purchase order. Hope to cooperate smoothly
    5 Stars By Alexandra from Jamaica - 2018.05.22 12:13
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