Professional China Flex Printed Circuit Boards - 10 Layer ENIG Multilayer FR4 PCB – Huihe

How To Improve The Lamination Quality Of Multilayer PCB?

PCB has developed from single side to double side and multilayer, and the proportion of multilayer PCB is increasing year by year. The performance of multilayer PCB is developing to high precision, dense and fine. Lamination is an important process in multilayer PCB manufacturing. The control of lamination quality is becoming more and more important. Therefore, in order to ensure the quality of multilayer laminate, we need to have a better understanding of the multilayer laminate process. How to improve the quality of multilayer laminate?

1. The thickness of the core plate should be selected according to the total thickness of the multilayer PCB. The thickness of the core plate should be consistent, the deviation is small, and the cutting direction is consistent, so as to prevent unnecessary plate bending.

2. There should be a certain distance between the dimension of the core plate and the effective unit, that is, the distance between the effective unit and the plate edge should be as large as possible without wasting materials.

3. In order to reduce the deviation between layers, special attention should be paid to the design of locating holes. However, the higher the number of designed positioning holes, rivet holes and tool holes is, the more the number of designed holes is, and the position should be as close to the side as possible. The main purpose is to reduce the alignment deviation between layers and to leave more space for manufacturing.

4. The inner core board is required to be free of open, short, open circuit, oxidation, clean board surface and residual film.

A Variety Of PCB Processes

Heavy Copper PCB 

Copper can be up to 12 OZ and has a high current

The material is FR-4 /Teflon/ceramic

Applied to high power supply, motor circuit

Blind Buried Via PCB

Use micro-blind holes to increase the line density

Improve radio frequency and electromagnetic interference, heat conduction

Apply to servers, mobile phones, and digital cameras

High Tg PCB

Glass conversion temperature Tg≥170℃

High heat resistance, suitable for lead-free process

Used in instrumentation, microwave rf equipment

High Frequency PCB

The Dk is small and the transmission delay is small

The Df is small, and the signal loss is small

Applied to 5G, rail transit, Internet of things

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