Original Factory 4 Layer Fpc - 8 Layer ENIG Multilayer FR4 PCB – Huihe

Challenges Of The Multilayer PCB

Multilayer PCB designs are more expensive than other types. There are some usability issues. Because of its complexity, the production time is quite long. Professional designer who needs to manufacture multilayer PCB.

Main Features Of Multilayer PCB

1. Used with integrated circuit, it is conducive to miniaturization and weight reduction of the whole machine;

2. Short wiring, straight wiring, high wiring density;

3. Because the shielding layer is added, the signal distortion of the circuit can be reduced;

4. The grounding heat dissipation layer is introduced to reduce local overheating and improve the stability of the whole machine. At present, most of the more complex circuit systems adopt the structure of multilayer PCB.

A Variety Of PCB Processes

Half Hole PCB

There is no residual or warping of copper thorn in half hole

The child board of the mother board saves connectors and space

Applied to Bluetooth module, signal receiver

Multilayer PCB

Minimum line width and line spacing 3/3mil

BGA 0.4pitch, minimum hole 0.1mm

Used in industrial control and consumer electronics

High Tg PCB

Glass conversion temperature Tg≥170℃

High heat resistance, suitable for lead-free process

Used in instrumentation, microwave rf equipment

High Frequency PCB

The Dk is small and the transmission delay is small

The Df is small, and the signal loss is small

Applied to 5G, rail transit, Internet of things