Best Hot sale Factory 4 Layer Pcb Prototype - 14 Layer ENIG FR4 Buried Via PCB – Huihe Manufacturer and Factory

Hot sale Factory 4 Layer Pcb Prototype - 14 Layer ENIG FR4 Buried Via PCB – Huihe

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Hot sale Factory 4 Layer Pcb Prototype - 14 Layer ENIG FR4 Buried Via PCB – Huihe Detail:

About Blind Buried Via PCB

Blind vias and buried vias are two ways to establish connections between layers of printed circuit board. The blind vias of the printed circuit board are copper-plated vias that can be connected to the outer layer through most of the inner layer. The burrow connects two or more inner layers but does not penetrate the outer layer. Use microblind vias to increase line distribution density, improve radio frequency and electromagnetic interference, heat conduction, applied to servers, mobile phones, digital cameras.

Buried Vias PCB

The buried Vias connects two or more inner layers but does not penetrate the outer layer

	Min Hole Diameter/mm	Min ring/mm	via-in-pad Diameter/mm	Maximum Diameter/mm	Aspect Ratio
Blind Vias(conventional)	0.1	0.1	0.3	0.4	1:10
Blind Vias(special product)	0.075	0.075	0.225	0.4	1:12

Blind Vias PCB

Blind Vias is to connect an outer layer to at least one inner layer

	Min. Hole Diameter/mm	Minimum ring/mm	via-in-pad Diameter/mm	Maximum Diameter/mm	Aspect Ratio
Blind Vias(mechanical drilling)	0.1	0.1	0.3	0.4	1:10
Blind Vias(Laser drilling)	0.075	0.075	0.225	0.4	1:12

The advantage of blind Vias and buried Vias for engineers is the increase of component density without increasing layer number and size of circuit board. For electronic products with narrow space and small design tolerance, blind hole design is a good choice. The use of such holes helps the circuit design engineer to design a reasonable hole/pad ratio to avoid excessive ratios.

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