High Quality for Pcb Mass Production - 6 Layer ENIG Multilayer FR4 PCB – Huihe

About Multilayer PCB

The biggest difference between multilayer PCB and single panel and double panel is that the internal power supply layer (to maintain the internal power layer) and the ground layer are added. The power supply and ground wire network are mainly wired on the power supply layer. However, the multilayer wiring is mainly the top and bottom layer, with the middle wiring layer as a supplement. Therefore, the design method of multilayer.
PCB is basically the same as that of double-panel. The key lies in how to optimize the wiring of the internal electrical layer, so that the wiring of the PCB is more reasonable and the electromagnetic compatibility is better. A variety of processes, to provide customers with cost-effective PCB.

Our Advantages For Multilayer PCB

A Variety Of PCB Processes

High Tg PCB

Glass conversion temperature Tg≥170℃

High heat resistance, suitable for lead-free process

Used in instrumentation, microwave rf equipment

High Frequency PCB

The Dk is small and the transmission delay is small

The Df is small, and the signal loss is small

Applied to 5G, rail transit, Internet of things

Impedance Control PCB

Strictly control the conductor width / thickness and medium thickness

Impedance linewidth tolerance ≤± 5%, good impedance matching

Applied to high-frequency and high-speed devices and 5g communication equipment

Heavy Copper PCB

Copper can be up to 12 OZ and has a high current

The material is FR-4/Teflon/ceramic

Applied to high power supply, motor circuit