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Competitive Price for Multi Layer Board - 14 Layer ENIG FR4 Buried Via PCB – Huihe

Competitive Price for Multi Layer Board - 14 Layer ENIG FR4 Buried Via PCB – Huihe

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Competitive Price for Multi Layer Board - 14 Layer ENIG FR4 Buried Via PCB – Huihe Detail:

About Blind Buried Via PCB

Blind vias and buried vias are two ways to establish connections between layers of printed circuit board. The blind vias of the printed circuit board are copper-plated vias that can be connected to the outer layer through most of the inner layer. The burrow connects two or more inner layers but does not penetrate the outer layer. Use microblind vias to increase line distribution density, improve radio frequency and electromagnetic interference, heat conduction, applied to servers, mobile phones, digital cameras.

Buried Vias PCB

The buried Vias connects two or more inner layers but does not penetrate the outer layer

Min Hole Diameter/mm

Min ring/mm

via-in-pad Diameter/mm

Maximum Diameter/mm

Aspect Ratio

Blind Vias(conventional)

              0.1

      0.1

          0.3

           0.4

    1:10

Blind Vias(special product)

              0.075

      0.075

          0.225

           0.4

    1:12

Blind Vias PCB

Blind Vias is to connect an outer layer to at least one inner layer

 

Min. Hole Diameter/mm

Minimum ring/mm

via-in-pad Diameter/mm

Maximum Diameter/mm

Aspect Ratio

Blind Vias(mechanical drilling)

    0.1

     0.1

     0.3

     0.4

   1:10

Blind Vias(Laser drilling)

    0.075

     0.075

     0.225

     0.4

   1:12

The advantage of blind Vias and buried Vias for engineers is the increase of component density without increasing layer number and size of circuit board. For electronic products with narrow space and small design tolerance, blind hole design is a good choice. The use of such holes helps the circuit design engineer to design a reasonable hole/pad ratio to avoid excessive ratios.


Product detail pictures:

Competitive Price for Multi Layer Board - 14 Layer ENIG FR4 Buried Via PCB – Huihe detail pictures

Competitive Price for Multi Layer Board - 14 Layer ENIG FR4 Buried Via PCB – Huihe detail pictures

Competitive Price for Multi Layer Board - 14 Layer ENIG FR4 Buried Via PCB – Huihe detail pictures


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With our leading technology at the same time as our spirit of innovation,mutual cooperation, benefits and growth, we're going to build a prosperous future together with your esteemed firm for Competitive Price for Multi Layer Board - 14 Layer ENIG FR4 Buried Via PCB – Huihe , The product will supply to all over the world, such as: Colombia, Uruguay, azerbaijan, We are adhering to the philosophy of "attracting customers with the best products and excellent service". We welcome customers, business associations and friends from all parts of the world to contact us and seek cooperation for mutual benefits.
  • The sales manager is very patient, we communicated about three days before we decided to cooperate, finally, we are very satisfied with this cooperation!
    5 Stars By Laurel from Riyadh - 2018.12.11 11:26
    The factory workers have rich industry knowledge and operational experience, we learned a lot in working with them,we are extremely grateful that we can encount a good company has excellent wokers.
    5 Stars By Caroline from Hanover - 2018.12.05 13:53
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