China Wholesale Round Pcb Board Factories - 14 Layer Blind Buried Via PCB – Huihe
China Wholesale Round Pcb Board Factories - 14 Layer Blind Buried Via PCB – Huihe Detail:
About Blind Buried Via PCB
Blind vias and buried vias are two ways to establish connections between layers of printed circuit board. The blind vias of the printed circuit board are copper-plated vias that can be connected to the outer layer through most of the inner layer. The burrow connects two or more inner layers but does not penetrate the outer layer. Use microblind vias to increase line distribution density, improve radio frequency and electromagnetic interference, heat conduction, applied to servers, mobile phones, digital cameras.
Buried Vias
The buried Vias connects two or more inner layers but does not penetrate the outer layer
|
Min. Hole Diameter/mm |
Minimum ring/mm |
via-in-pad Diameter/mm |
Maximum Diameter/mm |
Aspect Ratio |
Blind Vias(conventional) |
0.1 |
0.1 |
0.3 |
0.4 |
1:10 |
Blind Vias (special product) |
0.075 |
0.075 |
0.225 |
0.4 |
1:12 |
Blind Vias
Blind Vias is to connect an outer layer to at least one inner layer
|
Min. Hole Diameter/mm |
Minimum ring/mm |
via-in-pad Diameter/mm |
Maximum Diameter/mm |
Aspect Ratio |
Blind Vias(mechanical drilling) |
0.1 |
0.1 |
0.3 |
0.4 |
1:10 |
Blind Vias (Laser drilling) |
0.075 |
0.075 |
0.225 |
0.4 |
1:12 |
Equipment display
Automatic Plating Line
PTH line
LDI
CCD Exposure Machine
The advantage of blind Vias and buried Vias for engineers is the increase of component density without increasing layer number and size of circuit board. For electronic products with narrow space and small design tolerance, blind hole design is a good choice. The use of such holes helps the circuit design engineer to design a reasonable hole/pad ratio to avoid excessive ratios.
Application
Communications
Security electronics
Railtransit
Our factory
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