China Wholesale Printed Circuit Fabrication Quotes - 8 Layer ENIG Blind Buried Via PCB 12 – Huihe

About Level 1

Level 1 HDI technology refers to the laser blind hole only connected to the surface layer and its adjacent secondary layer hole forming technology.

pressing in one time after drilling →utside again pressing copper foil → and then laser drilling

About Level 1

Level 2 HDI PCB

The Level 2 HDI technology is an improvement on the Level 1 HDI technology. It includes two forms of laser blind via drilling directly from the surface layer to the third layer, and laser blind hole drilling directly from the surface layer to the second layer and then from the second layer to the third layer. The difficulty of the Level 2 HDI technology is far greater than the Level 1 HDI technology.

Press in one time after drilling →outside again pressing copper foil →laser, drilling→outer again pressing copper foil→ laser drilling

8 layers of double via Level 1 HDI PCB

The figure below is 8 layers of level 2 cross blind vias , this processing methodand the above eight layers of second order stack hole , also need to play twolaser perforations . But the perforations are not stacked on top of each othermaking it much less difficult to process.

8 layers of level 2 cross blind vias

Equipment display

Automatic Plating Line

PTH line

LDI

CCD Exposure Machine

Application

Communications

Security electronics

Railtransit

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