Best China Wholesale Impedance Control In Pcb Factories - 14 Layer Blind Buried Via PCB – Huihe Manufacturer and Factory

China Wholesale Impedance Control In Pcb Factories - 14 Layer Blind Buried Via PCB – Huihe

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Fast and very good quotations, informed advisers to help you choose the correct merchandise that suits all your preferences, a short creation time, responsible excellent command and different companies for paying and shipping affairs for Matte Black Pcb, Multi Layer Board, Medical Pcb, We maintain timely delivery schedules, impressive designs, high-quality and transparency for our buyers. Our moto is to deliver top quality solutions within stipulated time.

China Wholesale Impedance Control In Pcb Factories - 14 Layer Blind Buried Via PCB – Huihe Detail:

About Blind Buried Via PCB

Blind vias and buried vias are two ways to establish connections between layers of printed circuit board. The blind vias of the printed circuit board are copper-plated vias that can be connected to the outer layer through most of the inner layer. The burrow connects two or more inner layers but does not penetrate the outer layer. Use microblind vias to increase line distribution density, improve radio frequency and electromagnetic interference, heat conduction, applied to servers, mobile phones, digital cameras.

Buried Vias

The buried Vias connects two or more inner layers but does not penetrate the outer layer

Min. Hole Diameter/mm

Minimum ring/mm

via-in-pad Diameter/mm

Maximum Diameter/mm

Aspect Ratio

Blind Vias（conventional）

0.1

0.3

0.4

1:10

Blind Vias

(special product)

0.075

0.225

0.4

1:12

Blind Vias

Blind Vias is to connect an outer layer to at least one inner layer

Min. Hole Diameter/mm

Minimum ring/mm

via-in-pad Diameter/mm

Maximum Diameter/mm

Aspect Ratio

Blind Vias（mechanical drilling）

0.1

0.3

0.4

1:10

Blind Vias

(Laser drilling)

0.075

0.225

0.4

1:12

Equipment display

5-PCB circuit board automatic plating line

Automatic Plating Line

7-PCB circuit board PTH production line

PTH line

6 Layer Rogers+ FR4 PCB (4)

LDI

6 Layer Rogers+ FR4 PCB (2)

CCD Exposure Machine

The advantage of blind Vias and buried Vias for engineers is the increase of component density without increasing layer number and size of circuit board. For electronic products with narrow space and small design tolerance, blind hole design is a good choice. The use of such holes helps the circuit design engineer to design a reasonable hole/pad ratio to avoid excessive ratios.

Application

Communication Equipment

Communications

14 Layer Blind Buried Via PCB

Security electronics

Rail Transit

Railtransit

Our factory

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