China New Product Multi Circuit Board - 8 Layer HASL Multilayer FR4 PCB – Huihe

Why Are Multilayer PCB Boards Mostly Even?

Due to the lack of a layer of medium and foil, the cost of raw materials for odd PCB is slightly lower than that for even PCB. However, the processing cost of odd layer PCB is significantly higher than that of even layer PCB. The processing cost of the inner layer is the same, but the foil/core structure significantly increases the processing cost of the outer layer.

Odd layer PCB needs to add non-standard lamination core layer bonding process on the basis of core structure process. Compared with the nuclear structure, the production efficiency of the plant with foil coating outside the nuclear structure will be reduced. Prior to lamination, the outer core requires additional processing, which increases the risk of scratches and etching errors on the outer layer.

A Variety Of PCB Processes

Rigid-Flex PCB

Flexible and thin, simplifying the product assembly process

Reduce connectors, high line carrying capacity

Used in image system and RF communication equipment

Multilayer PCB

Minimum line width and line spacing 3 /3mil

BGA 0.4pitch, minimum hole 0.1mm

Used in industrial control and consumer electronics

Impedance Control PCB

Strictly control the conductor width / thickness and medium thickness

Impedance linewidth tolerance ≤± 5%, good impedance matching

Applied to high-frequency and high-speed devices and 5g communication equipment

Half Hole PCB

There is no residual or warping of copper thorn in half hole

The child board of the mother board saves connectors and space

Applied to Bluetooth module, signal receiver