Layers: 6 Surface finish: ENIG Base material: High Tg FR4 Outer Layer W/S: 5/5mil Inner layer W/S: 5/5mil Thickness: 1.0mm Min. hole diameter: 0.2mm Special process: Gold Finger
Layers: 2 Surface finish: HASL Base material: Tg170 FR4 Thickness: 1.0mm Min. hole diameter: 0.5mm Special process: Coil Resistance, Heavy Copper
Layers: 4 Surface finish: ENIG Base material: FR4 S1141 Outer Layer W/S: 5.5/3.5mil Inner layer W/S: 5/4mil Thickness: 1.6mm Min. hole diameter: 0.25mm Special process: Impedance Control+Heavy Copper
Layers: 6 Surface finish: ENIG Base material: FR4 Outer Layer W/S: 4/2.5mil Inner layer W/S: 4/3.5mil Thickness: 1.2mm Min. hole diameter: 0.2mm
Layers: 2 Surface finish: ENIG Base material: FR4 Outer Layer W/S: 11/4mil Thickness: 2.5mm Min. hole diameter: 0.35mm
Layers: 14 Surface finish: ENIG Base material: FR4 Outer Layer W/S: 4/5mil Inner layer W/S: 4/3.5mil Thickness: 1.6mm Min. hole diameter: 0.2mm Special process: Blind & Buried Vias
Layers: 4 Surface finish: ENIG Base material: FR4 Outer Layer W/S: 6/4mil Inner layer W/S: 6/5mil Thickness:1.6mm Min. hole diameter: 0.3mm Special process: Blind & Buried Vias, impedance control
Layers: 12 Surface finish: ENIG Base material: FR4 Outer Layer W/S: 7/4mil Inner layer W/S: 5/4mil Thickness:1.5mm Min. hole diameter: 0.25mm
Layers: 8 Surface finish: ENIG Base material: FR4 Outer Layer W/S: 4.5/3.5mil Inner layer W/S: 4.5/3.5mil Thickness: 1.6mm Min. hole diameter: 0.25mm Special process: Blind & Buried Vias ,impedance control
Layers: 6 Surface finish: ENIG Base material: FR4 W/S: 5/4mil Thickness: 1.0mm Min. hole diameter: 0.2mm Special process: Blind Vias
Layer: 8 Application Industry: Industrial Control W/S: 5/5mil Board Thickness: 1.6mm MIn. Hole Diameter: 0.2mm Surface Finish: ENIG Material: FR4 + FPC laminate:2R+2F+2F+2R
Layer: 6 Application Industry: Medical ventilator W/S: 4/4mil Board Thickness: 0.8mm MIn. Hole Diameter: 0.15mm Surface Finish: ENIG Material: FR4 + FPC
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