Layers: 8 Application Industry: Industrial Control Surface finish: ENIG W/S: 6/6mil Thickness: 1.6mm Min. hole diameter:0.2mm laminate:1R+2R+2F+2R+1R
Layers: 10 Surface finish: ENIG Base material: FR4 Outer Layer W/S: 4.5/2.5mil Inner layer W/S: 4/3.5mil Thickness: 1.0mm Min. hole diameter: 0.3mm
Layers: 4
Surface finish: ENIG
Base material: FR4
Outer Layer W/S: 12/5mil
Inner layer W/S: 12/5mil
Thickness: 1.6mm
Min. hole diameter: 0.25mm
Layers: 4 Materials:FR4+Rogers 4350B Min. hole diameter: 0.3mm Minimum Line Width:0.230mm Minimum Line Space:0.170mm Surface Treatment:ENIG Thickness:1.0mm
Layer: 4 Application Industry: Industrial Control W/S: 6/6mil Board Thickness: 0.4mm MIn. Hole Diameter: 0.2mm Surface Finish: ENIG Material: FR4 + FPC laminate:1F+2R+1R
Layers: 8 Application Industry: Industrial Control Surface finish: ENIG Base material: FR4 + FPC W/S: 5/5mil Thickness: 1.6mm Min. hole diameter:0.2mm laminate:2R+2F+2F+2R
Layer: 4 Special Processing: Rigid-Flex Material: FR4+FPC Outer Track W/S: 4/3.5mil Inner Track W/S: 5/4mil Board Thickness: 0.5mm Min. Hole Diameter: 0.2mm
Layers: 8 Surface finish: ENIG Base material: FR4 Outer Layer W/S: 7/4mil Inner layer W/S: 5/4.5mil Thickness: 1.0mm Min. hole diameter: 0.2mm Special process: Impedance Control+Heavy Copper
Layers: 10 Surface finish: ENIG Base material: FR4 W/S: 4/4mil Thickness: 1.6mm Min. hole diameter: 0.2mm Special process: Blind Vias
Layers: 6 Surface finish: HASL Base material: FR4 Outer Layer W/S: 9/4mil Inner layer W/S: 11/7mil Thickness:1.6mm Min. hole diameter: 0.3mm
Layers: 8 Surface finish: ENIG Base material: FR4 Outer Layer W/S: 3/3mil Inner layer W/S: 3/3mil Thickness: 0.8mm Min. hole diameter: 0.1mm Special process: Blind & Buried Vias
Layers: 6 Surface finish: ENIG Base material: FR4 Outer Layer W/S: 4/4mil Inner layer W/S: 4/4mil Thickness: 1.2mm Min. hole diameter: 0.2mm Special process:Impedance, half hole
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