Layers: 8
Surface finish: ENIG
Base material: FR4
Outer Layer W/S: 4.5/3.5mil
Inner layer W/S: 4.5/3.5mil
Thickness: 1.2mm
Min. hole diameter:0.15mm
Special process: via-in-pad
Layers: 6
Outer Layer W/S: 4/3.5mil
Thickness: 1.0mm
Min. hole diameter:0.2mm
Special process: via in pad
Layers: 10
Aspect Ratio: 8:1
Outer Layer W/S: 4/4mil
Inner layer W/S: 5/3.5mil
Thickness: 2.0mm
Min. hole diameter:0.25mm
Special process: Impedance Control, Resin Plugging, Different Copper Thickness
Min. hole diameter: 0.25mm
Thickness diameter ratio:8:1
Inner layer W/S: 4/3.5mil
Special process: via-in-pad, impedance control
Layers: 4 Surface finish: ENIG Base material: Arlon AD255+Rogers RO4003C Min. hole diameter: 0.5mm Minimum W/S:7/6mil Thickness: 1.8mm Special process:Blind hole
Layers: 12 Surface finish: ENIG Base material: FR4 Outer Layer W/S: 5/4mil Inner layer W/S: 4/5mil Thickness: 3.0mm Min. hole diameter: 0.3mm Special process: 5/5mil impedance control line
Layer: 6 W/S: 4/4mil Board Thickness: 1.6mm MIn. Hole Diameter: 0.2mm Special Processing:level 1 HDI Blind Via:0.07mm Surface Finish: ENIG laminate:2R+2F+2R Application Industry: automotive radar
Layers: 8 Surface finish: ENIG Base material: FR4 Outer Layer W/S: 4/4mil Inner layer W/S: 3.5/3.5mil Thickness: 1.6mm Min. hole diameter: 0.45mm
Layers: 4 Surface finish: ENIG Base material: FR4 Tg170 Outer Layer W/S: 5.5/6mil Inner layer W/S: 17.5mil Thickness: 1.0mm Min. hole diameter: 0.5mm Special process: Blind Vias
Layer: 10 Surface finish: ENIG Material: FR4 Tg170 Outer line W/S: 10/7.5mil Inner line W/S: 3.5/7mil Board thickness: 2.0mm Min. hole diameter: 0.15mm Plug hole: via filling plating
Layers: 4
Outer Layer W/S: 9/4mil
Inner layer W/S: 7/4mil
Thickness: 0.8mm
Min. hole diameter: 0.2mm
Special process:Impedance, half hole
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