Layers: 8 Surface finish: ENIG Base material: High TG FR4 Outer Layer W/S: 3.5/4mil Inner layer W/S: 4/3.5mil Thickness: 1.0mm Min. hole diameter: 0.2mm Special process: impedance control
Layers: 10 Surface finish: ENIG Base material: FR4 TG150 Outer Layer W/S: 9/8mil Inner layer W/S: 6.5/6.5mil Thickness: 4.0mm Min. hole diameter: 0.5mm
Layers: 6 size:357*224mm Surface finish: ENIG Base material: FR4 TG170, Rogers 4350B Min. hole diameter: 0.25mm Minimum Line Width:0.127mm Minimum Line Space:0.127mm Thickness: 1.6mm Special process:Blind hole
Layers: 4 size:190*210mm Surface finish: ENIG Base material: FR4+Rogers 4350B Min. hole diameter: 0.4mm Minimum Line Width:0.279mm Minimum Line Space:0.1mm Thickness:1.4mm
Layers: 4 size:61.6*27mm Surface finish: ENIG Base material: FR4+Rogers 4350B Min. hole diameter: 0.3mm Minimum Line Width:0.252mm Minimum Line Space:0.102mm Thickness: 1.6mm
Layers: 4 size:104*100mm Surface finish: ENIG Base material: Rogers 4350B Min. hole diameter: 0.3mm Minimum Line Width:0.165mm Minimum Line Space:0.124mm Thickness: 0.8mm
Layers: 2 Base material: F4BM Copper thick:1 OZ Surface finish: OSP Thickness: 1.6mm
Layers: 4 Surface finish: ENIG Base material: Taconic RF-35 Min. hole diameter: 0.8mm Outer Layer W/S: 12/12mil Inner layer W/S: 12/12mil Thickness: 0.762mm
Layers: 6 Surface finish: ENIG Base material: ROGERS 4350 + FR4 Outer Layer W/S: 7/7mil Inner layer W/S: 5/5mil Thickness: 2.3mm Min. hole diameter: 0.6mm Special process:mixed-dielectric
Layers: 6
Surface finish: ENIG
Base material: FR4
Outer Layer W/S: 6/4mil
Inner layer W/S: 4/4mil
Thickness: 2.8mm
Min. hole diameter:0.35mm
Special process: Impedance Control
W/S: 5/4mil
Thickness: 1.0mm
Min. hole diameter:0.2mm
Special process: via-in-pad
Outer Layer W/S: 7/3.5mil
Inner layer W/S: 7/4mil
Thickness: 0.8mm
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