OEM/ODM China Create Printed Circuit Board - 6 Layer ENIG Automotive Radar Rigid Flex PCB – Huihe

Physical Characteristics Of Rigid Flex PCB

The rigid flex PCB in the material, equipment and process, and the original FPC PCB, the rigid PCB has differences. In terms of material, rigid PCB material the FR4 is PCB material, such as the fpc board material is PI or PET class material, between the two materials have different problems, such as joint, thermal shrinkage is a difficult point for the stability of the product, and the characteristic of PCB for stereo space configuration, in addition to the XY plane direction stress calculation, Stress bearing in the Z-axis direction is also an important consideration. At present, some material suppliers provide modified materials suitable for rigid flex PCB boards, such as Epoxy or modified Resin, to PCB board or FPC board manufacturers, in order to meet the joint problems between PCB board or FPC .

In terms of equipment, due to the material characteristics and product specifications of the rigid flex PCB, in the lamination and copper plating part of the equipment must be modified, the degree of applicability of equipment will affect the product yield and stability, so into the production of rigid flex PCB must first consider the degree of equipment.

The Development Prospect Of Rigid Flex PCB

The rigid flex PCB has the stability of rigid PCB and the characteristics of FPC can be three-dimensional assembly, so the development prospect is very considerable. In 2019, the global market size of rigid flex PCB board was about $1.66 billion, accounting for only about 2.8% of the overall circuit board; however, smart phones, wireless headsets, drones, cars, AR/VR devices and so on are the products with the highest growth rate in 2019, and in the case of more and more subsequent applications, the rigid flex PCB board is still the product with the most growth momentum in 2020.

Consumer electronics was the largest market for FBS in 2019, accounting for about 43% of the overall FBS market. Applications including smartphone camera lenses, screen signal connections, and battery modules all saw a significant increase in demand for FBS. Especially in the application of smartphone camera lens, as multi-lens mobile phone has become the design trend of various mobile phone brands, the increase in the demand number of rigid flex PCB boards or the increase in the average unit price will increase the proportion of consumer electronics market.

Due to the demand of light, thin and high density of mobile phone lens, it needs to be applied to the rigid flex PCB. In addition, based on the location, direction, signal interference, heat dissipation and consideration of many factors, such as specifications set plus part of the lens for optical zoom demand under the structure design, making mobile phone camera to meet increasingly stringent space limitations, appeared a variety of different types, from the appearance on the technology of rigid flex PCB requirements more stringent, its application is more extensive.