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    • 8 Year Exporter Led Circuit Board Price - 10 Layer ENIG FR4 Blind Vias PCB – Huihe

      8 Year Exporter Led Circuit Board Price - 10 Layer ENIG FR4 Blind Vias PCB – Huihe

      About Blind Buried Via PCB Blind Via: which enables the connection and conduction between the inner and outer layers Buried Via: which can connect and guide between inner layers Blind Vias are mostly small holes with a diameter of 0.05mm~0.15mm. There are laser hole forming, plasma etched hole and photoinduced hole forming, and laser hole forming is usually used. HDI: High-density interconnection, non-mechanical drilling, micro-blind hole ring below 6mil, inside and outside layers of wiring l...
    • Wholesale Price Bare Board Factory - 6 Layer FR4 ENIG Via In Pad PCB – Huihe

      Wholesale Price Bare Board Factory - 6 Layer FR4 ENIG Via In Pad PCB – Huihe

      Impedance Characteristics Of PCB According to the signal transmission theory, the signal is a function of time and distance variables, so every part of the signal on the line may change. Therefore, the AC impedance of the transmission line, that is, the ratio of voltage change to current change, is determined as the characteristic impedance of the transmission line. The characteristic impedance of the transmission line is only related to the characteristics of the signal connection itself. In...
    • China Supplier China Flex Pcb - 10 Layer High Density ENIG Multilayer PCB  – Huihe

      China Supplier China Flex Pcb - 10 Layer High Density ENIG Multilayer PCB – Huihe

      Advantages Of Multilayer Printed Circuit Boards While single-layer boards have their advantages, multilayer designs are more beneficial for some applications. For some devices, you may even need to have multiple layers. The benefits of more complex multilayer PCBs include: 1. For more complex projects: More complex devices involving more circuits and components often require the use of multiple layers of PCBS. If more circuitry is needed than can fit on a single board, you can increase ...
    • Professional Design Pcba Circuit Board - 6 Layer ENIG RO4350+FR4 Mixed Lamination PCB – Huihe

      Professional Design Pcba Circuit Board - 6 Layer ENIG RO4350+FR4 Mixed Lamination PCB – Huihe

      Mixed Lamination High Frequency PCB The electrical, thermal and mechanical properties of high-frequency materials are different from those of conventional FR-4 materials. High frequency PCB has low dielectric constant Dk, low transmission delay, low loss factor Df and low dielectric loss. The high-frequency microwave PCB board and RF board produced by HUIHE Circuit include 5G base station antenna circuit board, 4G intermodulation antenna circuit board, high-precision impedance circuit bo...
    • Professional Design Printed Circuit Board Production - 14 Layer ENIG FR4 Buried Via PCB – Huihe

      Professional Design Printed Circuit Board Production - 14 Layer ENIG FR4 Buried Via PCB – Huihe

      About Blind Buried Via PCB Blind vias and buried vias are two ways to establish connections between layers of printed circuit board. The blind vias of the printed circuit board are copper-plated vias that can be connected to the outer layer through most of the inner layer. The burrow connects two or more inner layers but does not penetrate the outer layer. Use microblind vias to increase line distribution density, improve radio frequency and electromagnetic interference, heat conduction, appl...
    • 8 Year Exporter Bass Filter Circuit Board - 4 Layer ENIG Impedance Half Hole PCB – Huihe

      8 Year Exporter Bass Filter Circuit Board - 4 Layer ENIG Impedance Half Hole PCB – Huihe

      Processing Method Of Metallized Half Hole PCB Drilling The specific metallized half-hole shall be processed in the following way: all metallized half-hole PCB holes shall be drilled in the way of drilling after drawing plating and before etching, one hole shall be drilled at the intersection points at both ends of the half-hole. 1) Formulate the MI process according to the technological process, 2) the metal half hole is a drill drill (or gong out), figure after plating, before etching two dr...
    • Factory directly supply Rohs Pcb Supplier - 6 Layer HASL Blind Buried Via PCB – Huihe

      Factory directly supply Rohs Pcb Supplier - 6 Layer HASL Blind Buried Via PCB – Huihe

      Features Of The Buried Via PCB The manufacturing process cannot be achieved by drilling after bonding. Drilling must be performed at individual circuit layers. The inner layer must be partially bonded first, followed by electroplating treatment, and then all bonded finally. This process is usually used only on high-density PCBs to increase the available space for other circuit layers The Basic Process Of HDI Blind Buried Via PCB Equipment Display PCB Automatic Plating Line PCB PTH Line ...
    • Low price for Gps Circuit Board - 4 Layer ENIG FR4 Half Hole PCB – Huihe

      Low price for Gps Circuit Board - 4 Layer ENIG FR4 Half Hole PCB – Huihe

      Conventional Metallized Half-Hole PCB Fabrication Process Drilling — Chemical Copper — Full Plate Copper — Image Transfer — Graphics Electroplating — Defilm — Etching — Stretch Soldering — Half Hole Surface Coating (Shaped at the Same Time with the Profile). The metallized half hole is cut in half after the round hole is formed. It is easy to appear the phenomenon of copper wire residue and copper leather warping in the half hole, which affects ...
    • Wholesale Price China High Frequency Pcb Manufacturer - 6 Layer FR4 ENIG Impedance Control PCB – Huihe

      Wholesale Price China High Frequency Pcb Manufacturer - 6 Layer FR4 ENIG Impedance Control PCB – Huihe

      About The Impedance Impedance is the combination of capacitance and inductance to block the circuit in high frequency signal. Impedance is a kind of AC characteristic, which means that it is related to frequency and is used to describe the high frequency characteristics of PCB. Factors Affecting Impedance DK (R): determined by raw materials (PCB material, semi cured sheet) Line Thickness (T): determined by raw materials and process capability. Line Width (W): determined by customer’s original...
    • Hot Sale for Pcb Shenzhen High Quality Fabrication Rigid Flex Pcb - 8 Layer ENIG Multilayer FR4 PCB – Huihe

      Hot Sale for Pcb Shenzhen High Quality Fabrication Rigid Flex Pcb - 8 Layer ENIG Multilayer FR4 PCB – Huihe

      Challenges Of The Multilayer PCB Multilayer PCB designs are more expensive than other types. There are some usability issues. Because of its complexity, the production time is quite long. Professional designer who needs to manufacture multilayer PCB. Main Features Of Multilayer PCB 1. Used with integrated circuit, it is conducive to miniaturization and weight reduction of the whole machine; 2. Short wiring, straight wiring, high wiring density; 3. Because the shielding layer is adde...
    • 2022 Latest Design Pcb High Tg - 6 Layer ENIG Multilayer FR4 PCB – Huihe

      2022 Latest Design Pcb High Tg - 6 Layer ENIG Multilayer FR4 PCB – Huihe

      About Multilayer PCB With the increasing complexity of circuit design, in order to increase the area of wiring, multilayer PCB can be used. Multilayer board is a PCB that contains multiple working layers. In addition to the top and bottom layers, it also includes signal layer, middle layer, internal power supply and ground layer. The number of layers of PCB represents that there are several independent wiring layers. Generally, the number of layers is even and includes the outermost two layer...
    • Wholesale Price China Bare Board Pcb - 12 Layer FR4 ENIG Impedance Control PCB – Huihe

      Wholesale Price China Bare Board Pcb - 12 Layer FR4 ENIG Impedance Control PCB – Huihe

      Why do PCB boards need impedance? 1. PCB circuit board to consider the insertion and installation of electronic components, later SMT patch insertion also need to consider the conductivity and signal transmission performance and other issues, so it will require the impedance as low as possible. 2. PCB circuit board in the production process of copper deposition, tin plating (or electroless plating, hot spray tin), soldering and other processes, the materials used must require low resisti...