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Factory Supply Half Hole - 6 Layer FR4 ENIG Impedance Control PCB – Huihe

Factory Supply Half Hole - 6 Layer FR4 ENIG Impedance Control PCB – Huihe

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Factory Supply Half Hole - 6 Layer FR4 ENIG Impedance Control PCB – Huihe Detail:

Difference Between Pad And Via

1. Definitions Differ Pad: is the basic unit of surface mount assembly, which is used to form the landpattern of the circuit board, that is, a variety of combinations of pads designed for special component types. Through hole: through hole is also called metallization hole. In the double panel and multilayer PCB, a common hole is drilled at the junction of the wires that need to be connected between the layers in order to connect the printed wires between layers. The main parameters of the hole are the outer diameter of the hole and the size of the hole. The hole itself has parasitic capacitance and inductance to the ground, which often brings great negative effect to the circuit design. 2. Different Principles Pad: When a pad structure is not designed correctly, it is difficult to reach the desired weld point. Can be used for surface-mounted components or for plug-in components. Through hole: In a circuit board, a line jumps from one side of the board to the other. The hole connecting the two wires is also called a hole (as opposed to a pad, there is no solder layer on the side). Also known as metallization hole, in the double panel and multilayer PCB, for connecting the printed wire between the layers, in each layer need to be connected at the intersection of the wire drilling on a public hole, that is, through the hole. Technically, a layer of metal is PCB on the cylindrical surface of the hole wall of the hole through the chemical deposition method to connect the copper foil that needs to be connected in the middle layer, and the upper and lower sides of the hole through the shape of a circular solder pad, the parameters of the hole mainly include the outer diameter of the hole and the size of the hole. 3. Different Effects Through hole: the hole on PCB, play the role of conduction or heat dissipation. Pad: it is the copper plate of PCB, some cooperate with the hole to connect, and some square plate, mainly used to paste parts.

Equipment Display

5-PCB circuit board automatic plating line

PCB Automatic Plating Line

7-PCB circuit board PTH production line

PCB PTH Line

15-PCB circuit board LDI automatic laser scanning line machine

PCB LDI

12-PCB circuit board CCD exposure machine

PCB CCD Exposure Machine


Product detail pictures:

Factory Supply Half Hole - 6 Layer FR4 ENIG Impedance Control PCB – Huihe detail pictures

Factory Supply Half Hole - 6 Layer FR4 ENIG Impedance Control PCB – Huihe detail pictures

Factory Supply Half Hole - 6 Layer FR4 ENIG Impedance Control PCB – Huihe detail pictures

Factory Supply Half Hole - 6 Layer FR4 ENIG Impedance Control PCB – Huihe detail pictures


Related Product Guide:

Our target is to consolidate and improve the quality and service of existing products, meanwhile constantly develop new products to meet different customers' demands for Factory Supply Half Hole - 6 Layer FR4 ENIG Impedance Control PCB – Huihe , The product will supply to all over the world, such as: Bandung, Greek, Victoria, The quality of our products is equal to OEM's quality, because our core parts are the same with OEM supplier. The above products have passed professional certification, and we not only can produce OEM-standard products but we also accept Customized Products order.
  • It is really lucky to meet such a good supplier, this is our most satisfied cooperation, I think we will work again!
    5 Stars By Kevin Ellyson from Kuwait - 2018.11.28 16:25
    This is the first business after our company establish, products and services are very satisfying, we have a good start, we hope to cooperate continuous in the future!
    5 Stars By Ruby from Rotterdam - 2017.11.01 17:04
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