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Factory directly Flexible Printed Circuit Board Market Manufacturers - 14 Layer ENIG FR4 Buried Via PCB – Huihe

Factory directly Flexible Printed Circuit Board Market Manufacturers - 14 Layer ENIG FR4 Buried Via PCB – Huihe

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With this motto in mind, we have become one of the most technologically innovative, cost-efficient, and price-competitive manufacturers for Rf Pcb, Prototype Pcb Assembly, Purple Pcbs, Encouraged with the fast producing current market on the speedy foodstuff and beverage consumables all around the entire world , We're hunting forward to functioning with partners/clients to create good results together.
Factory directly Flexible Printed Circuit Board Market Manufacturers - 14 Layer ENIG FR4 Buried Via PCB – Huihe Detail:

About Blind Buried Via PCB

Blind vias and buried vias are two ways to establish connections between layers of printed circuit board. The blind vias of the printed circuit board are copper-plated vias that can be connected to the outer layer through most of the inner layer. The burrow connects two or more inner layers but does not penetrate the outer layer. Use microblind vias to increase line distribution density, improve radio frequency and electromagnetic interference, heat conduction, applied to servers, mobile phones, digital cameras.

Buried Vias PCB

The buried Vias connects two or more inner layers but does not penetrate the outer layer

Min Hole Diameter/mm

Min ring/mm

via-in-pad Diameter/mm

Maximum Diameter/mm

Aspect Ratio

Blind Vias(conventional)

              0.1

      0.1

          0.3

           0.4

    1:10

Blind Vias(special product)

              0.075

      0.075

          0.225

           0.4

    1:12

Blind Vias PCB

Blind Vias is to connect an outer layer to at least one inner layer

 

Min. Hole Diameter/mm

Minimum ring/mm

via-in-pad Diameter/mm

Maximum Diameter/mm

Aspect Ratio

Blind Vias(mechanical drilling)

    0.1

     0.1

     0.3

     0.4

   1:10

Blind Vias(Laser drilling)

    0.075

     0.075

     0.225

     0.4

   1:12

The advantage of blind Vias and buried Vias for engineers is the increase of component density without increasing layer number and size of circuit board. For electronic products with narrow space and small design tolerance, blind hole design is a good choice. The use of such holes helps the circuit design engineer to design a reasonable hole/pad ratio to avoid excessive ratios.


Product detail pictures:

Factory directly Flexible Printed Circuit Board Market Manufacturers - 14 Layer ENIG FR4 Buried Via PCB – Huihe detail pictures

Factory directly Flexible Printed Circuit Board Market Manufacturers - 14 Layer ENIG FR4 Buried Via PCB – Huihe detail pictures

Factory directly Flexible Printed Circuit Board Market Manufacturers - 14 Layer ENIG FR4 Buried Via PCB – Huihe detail pictures


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To create much more benefit for consumers is our company philosophy; customer growing is our working chase for Factory directly Flexible Printed Circuit Board Market Manufacturers - 14 Layer ENIG FR4 Buried Via PCB – Huihe , The product will supply to all over the world, such as: Durban, Nigeria, British, Abiding by our motto of "Hold well the quality and services, Customers Satisfaction", So we provide our clients with high quality products and excellent service. Please feel free to contact us for further information.
  • The manufacturer gave us a big discount under the premise of ensuring the quality of products, thank you very much, we will select this company again.
    5 Stars By Bess from Nigeria - 2017.11.29 11:09
    As a veteran of this industry, we can say that the company can be a leader in the industry, select them is right.
    5 Stars By Dinah from Kenya - 2017.08.21 14:13
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