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8 Layer FR4 ENIG Tg170 PCB

8 Layer FR4 ENIG Tg170 PCB

Short Description:

Layers: 8
Surface finish: ENIG
Base material: High TG FR4
Outer Layer W/S: 3.5/4mil
Inner layer W/S: 4/3.5mil
Thickness: 1.0mm
Min. hole diameter: 0.2mm
Special process: impedance control


Product Detail

Advantages Of High Tg PCB

1. Higher stability: if the Tg of PCB is increased, it will automatically improve the heat resistance, chemical resistance, moisture resistance and device stability.

2.Withstand high power density design: if the device has high power density and fairly high calorific value, then high Tg PCB will be a good solution for heat management.

3.When reducing the heat generation of ordinary boards, larger printed circuit boards can be used to change the design and power requirements of the equipment, and high Tg PCB can also be used.

4. Ideal choice for multilayer and HDI PCB: because multilayer and HDI PCB are more compact and circuit intensive, it will lead to a high level of heat dissipation. Therefore, high Tg PCB is usually used for multilayer and HDI PCB to ensure the reliability of PCB manufacturing.

Equipment Display

5-PCB circuit board automatic plating line

PCB Automatic Plating Line

PCB circuit board PTH production line

PCB PTH Line

15-PCB circuit board LDI automatic laser scanning line machine

PCB LDI

12-PCB circuit board CCD exposure machine

PCB CCD Exposure Machine

Factory Show

Company profile

PCB Manufacturing Base

woleisbu

Admin Receptionist

manufacturing (2)

Meeting Room

manufacturing (1)

General Office


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