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8 Layer ENIG Multilayer FR4 PCB

8 Layer ENIG Multilayer FR4 PCB

Short Description:

Layers: 8
Surface finish: ENIG
Base material: FR4
Outer Layer W/S: 6/3.5mil
Inner layer W/S: 6/4mil
Thickness: 1.6mm
Min. hole diameter: 0.25mm
Special process: impedance control


Product Detail

Multilayer PCB Design Advantages

1.Compared with single-sided PCB and double-sided PCB, it has higher density.

2.No interconnect cable is required. It is the best choice for low weight PCB.

3.Multilayer PCBs have smaller sizes and save space.

4.EMI is very simple and flexible.

5.Durable and powerful.

Application Of Multilayer PCB

Multilayer PCB design is the basic requirement of many electronic components:

 

Accelerator

Mobile Transmission

Optical Fiber

Scanning Technology

File Server And Data Storage

A Variety Of PCB Processes

Rigid-Flex PCB

 

Flexible and thin, simplifying the product assembly process

Reduce connectors, high line carrying capacity

Used in image system and RF communication equipment

Rigid-Flex PCB
Half Hole PCB

Half Hole PCB

 

There is no residual or warping of copper thorn in half hole

The child board of the mother board saves connectors and space

Applied to Bluetooth module, signal receiver

Impedance Control PCB

 

Strictly control the conductor width / thickness and medium thickness

Impedance linewidth tolerance ≤± 5%, good impedance matching

Applied to high-frequency and high-speed devices and 5g communication equipment

Impedance Control PCB
Blind Buried Via PCB

Blind Buried Via PCB

 

Use micro-blind holes to increase the line density

Improve radio frequency and electromagnetic interference, heat conduction

Apply to servers, mobile phones, and digital cameras


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