8 Layer ENIG Impedance Control PCB
Challenges Of The Multilayer PCB
Multilayer PCB designs are more expensive than other types. There are some usability issues. Because of its complexity, the production time is quite long. Professional designer who needs to manufacture multilayer PCB.
Main Features Of Multilayer PCB
1. Used with integrated circuit, it is conducive to miniaturization and weight reduction of the whole machine;
2. Short wiring, straight wiring, high wiring density;
3. Because the shielding layer is added, the signal distortion of the circuit can be reduced;
4. The grounding heat dissipation layer is introduced to reduce local overheating and improve the stability of the whole machine. At present, most of the more complex circuit systems adopt the structure of multilayer PCB.
A Variety Of PCB Processes
Half Hole PCB
There is no residual or warping of copper thorn in half hole
The child board of the mother board saves connectors and space
Applied to Bluetooth module, signal receiver
Multilayer PCB
Minimum line width and line spacing 3/3mil
BGA 0.4pitch, minimum hole 0.1mm
Used in industrial control and consumer electronics
High Tg PCB
Glass conversion temperature Tg≥170℃
High heat resistance, suitable for lead-free process
Used in instrumentation, microwave rf equipment
High Frequency PCB
The Dk is small and the transmission delay is small
The Df is small, and the signal loss is small
Applied to 5G, rail transit, Internet of things