8 Layer ENIG Impedance Control Heavy Copper PCB
Thin Core Heavy Copper PCB Copper Foil Choice
The most concerned problem of heavy copper CCL PCB is the pressure resistance problem, especially the thin core heavy copper PCB (thin core is medium thickness ≤ 0.3mm), the pressure resistance problem is particularly prominent, thin core heavy copper PCB will generally choose RTF copper foil for production, RTF copper foil and STD copper foil main difference is the length of the wool Ra is different, RTF copper foil Ra is significantly less than STD copper foil.
The wool configuration of copper foil affects the thickness of the substrate insulation layer. With the same thickness specification, the RTF copper foil Ra is small, and the effective insulation layer of the dielectric layer is obviously thicker. By reducing the wool coarsening degree, the pressure resistance of the heavy copper of the thin substrate can be effectively improved.
Heavy Copper PCB CCL And Prepreg
Development and promotion of HTC materials: copper not only has good processability and conductivity, but also has good thermal conductivity. The use of heavy copper PCB and the application of HTC medium is gradually becoming the direction of more and more designers to solve the problem of heat dissipation. The use of HTC PCB with heavy copper foil design is more conducive to the overall heat dissipation of electronic components, and has obvious advantages in cost and process.
Equipment Display
PCB Automatic Plating Line
PCB PTH Line
PCB LDI
PCB CCD Exposure Machine
Factory Show
PCB Manufacturing Base
Admin Receptionist
Meeting Room
