6 Layer HASL Blind Buried Via PCB
Features Of The Buried Via PCB
The manufacturing process cannot be achieved by drilling after bonding. Drilling must be performed at individual circuit layers. The inner layer must be partially bonded first, followed by electroplating treatment, and then all bonded finally. This process is usually used only on high-density PCBs to increase the available space for other circuit layers
The Basic Process Of HDI Blind Buried Via PCB
Equipment Display
PCB Automatic Plating Line
PCB PTH Line
PCB LDI
PCB CCD Exposure Machine
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