4 Layer ENIG FR4+RO4350 Mixed Lamination PCB
Mixed Lamination High Frequency PCB
Mixed lamination high frequency PCB circuit boards are pressed using different laminated materials to optimize electrical performance and improve system reliability. The biggest challenge in manufacturing this type of high frequency PCB is to match the thermal expansion coefficient (CTE) of the different materials to fit the PCB manufacturing and component assembly. Typically, such circuit designs include a combination of FR-4 materials and PTFE laminated materials.
All well-known laminate manufacturers, such as Isola, Rogers, Arlon and Taconic, have released key technical parameters regarding the performance of their laminates. High-frequency PCB with induction heating technology has been widely used in the communication industry, network technology field promotion and high-speed information processing system, to meet the requirements of many high-precision parameters of the instrument.
Application Of Mixing Lamination High Frequency PCB
High frequency PCB has been widely used in many industries
Communication products
Industrial devices
Radar system
Medical electronic
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PCB Automatic Plating Line
PCB PTH Line
PCB LDI
PCB CCD Exposure Machine
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PCB Manufacturing Base
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