12 Layer ENIG FR4 Blind Vias PCB
HDI PCB Material
HDI PCB materials are RCC, LDPE, FR4
RCC:Resin coated Copper is short for resin coated copper foil. RCC is composed of copper foil and resin with rough surface, heat resistance and anti-oxidation treatment (used when the thickness is more than 4mil).The resin layer of RCC has the same processability as FR4 adhesive sheet (prepreg). In addition, it should also meet the relevant performance requirements of the laminate, such as:
(1) High insulation reliability and micro via reliability;
(2) High glass transition temperature (TG);
(3) Low dielectric constant and water absorption;
(4) It has high adhesion and strength to copper foil;
(5) After curing, the thickness of insulation layer is uniform
At the same time, because RCC is a new type of product without glass fiber, it is conducive to laser and plasma etching treatment, and is conducive to the lightweight and thin multi-layer plate. In addition, resin coated copper foil has 12pm, 18pm thin copper foil, easy to process.