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12 Layer ENIG FR4 Blind Vias PCB

12 Layer ENIG FR4 Blind Vias PCB

Short Description:

Layers: 12
Surface finish: ENIG
Base material: FR4
Outer Layer W/S: 7/4mil
Inner layer W/S: 5/4mil
Thickness:1.5mm
Min. hole diameter: 0.25mm


Product Detail

HDI PCB Material

HDI PCB materials are RCC, LDPE, FR4

RCC:Resin coated Copper is short for resin coated copper foil. RCC is composed of copper foil and resin with rough surface, heat resistance and anti-oxidation treatment (used when the thickness is more than 4mil).The resin layer of RCC has the same processability as FR4 adhesive sheet (prepreg). In addition, it should also meet the relevant performance requirements of the laminate, such as:

(1) High insulation reliability and micro via reliability;

(2) High glass transition temperature (TG);

(3) Low dielectric constant and water absorption;

(4) It has high adhesion and strength to copper foil;

(5) After curing, the thickness of insulation layer is uniform

At the same time, because RCC is a new type of product without glass fiber, it is conducive to laser and plasma etching treatment, and is conducive to the lightweight and thin multi-layer plate. In addition, resin coated copper foil has 12pm, 18pm thin copper foil, easy to process.

Equipment Display

5-PCB circuit board automatic plating line

PCB Automatic Plating Line

PCB circuit board PTH production line

PCB PTH Line

15-PCB circuit board LDI automatic laser scanning line machine

PCB LDI

12-PCB circuit board CCD exposure machine

PCB CCD Exposure Machine

Factory Show

Company profile

PCB Manufacturing Base

woleisbu

Admin Receptionist

manufacturing (2)

Meeting Room

manufacturing (1)

General Office


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